Author:
Yan Chao,Zhu Hengliang,Zhou Dian,Zeng Xuan
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Temperature-Aware Design and Optimization of Reliable Cyber-Physical Systems;2023 International Conference on Electrical, Computer and Energy Technologies (ICECET);2023-11-16
2. A Fast Leakage-Aware Green’s-Function-Based Thermal Simulator for 3-D Chips;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2020-11
3. A Survey of Chip-level Thermal Simulators;ACM Computing Surveys;2019-05-31
4. The MTA: An Advanced and Versatile Thermal Simulator for Integrated Systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2018-12