Thermal Transient Measurements of GaN HEMT Structures by Electrical Measurements
Author:
Affiliation:
1. Chalmers University of Technology,Gothenburg,Sweden
2. Saab AB,Stockholm,Sweden
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10288583/10288635/10288814.pdf?arnumber=10288814
Reference14 articles.
1. GaN MMIC real-time on-chip temperature monitoring and characterization;divinyi;presented at C3NiT day,0
2. Models for the self-heating evaluation of a gallium nitride-based high electron mobility transistor;florovi?;Semiconductor Science and Technology,2020
3. Temperature-Dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique
4. Resistive nickel temperature sensor integrated into short-gate length AlGaN/GaN HEMT dedicated to RF applications
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Characterization and Modeling of Dynamic Thermal Coupling in GaN MMIC Power Amplifiers;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16
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