Comparison between Microstrip-line and Substrate Integrated Waveguide on Package Substrate in 170 GHz and 300 GHz Bands-Reference-Cited by-同舟云学术

Comparison between Microstrip-line and Substrate Integrated Waveguide on Package Substrate in 170 GHz and 300 GHz Bands

Published:2022-11-29 Issue: Volume: Page:
ISSN:
Container-title:2022 Asia-Pacific Microwave Conference (APMC)
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Author:

Morishita Yohei¹,Takahashi Ken²,Hasaba Ryosuke¹,Murata Tomohiro¹,Takinami Koji¹,Kitamura Hidenori³,Sangawa Ushio³,Tomura Takashi⁴,Watanabe Issei⁵

Affiliation:

1. Panasonic Industry Co., Ltd.,Engineering Division,Yokohama City,Japan,224-8539

2. Panasonic System Networks R&D Lab. Co., Ltd.,Technology Center,Yokohama City,Japan,224-8539

3. Panasonic Industry Co., Ltd.,Electronic Materials Business Division,Yokohama City,Japan,224-8539

4. Tokyo Institute of Technology,Department of Electrical and Electronic Engineering,Yokohama City,Japan,224-8539

5. Advanced ICT Research Institute, National Institute of Information and Communications Technology,Yokohama City,Japan,224-8539

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9999720/9999721/09999775.pdf?arnumber=9999775

Reference6 articles.

1. Substrate Integrated Transmission Lines: Review and Applications

2. 300-GHz-Band OFDM Video Transmission with CMOS TX/RX Modules and 40dBi Cassegrain Antenna toward 6G

3. Modeling of losses in substrate integrated waveguide components

4. Millimeter-Wave Band Evaluation of Microstrip - Line Transmission Losses using Effective Conductivity Measured by a Whispering Gallery Mode Resonator;she;ISAP'08 No 1645183,2008

5. 300-GHz-Band 120-Gb/s Wireless Front-End Based on InP-HEMT PAs and Mixers

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