Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact-Reference-Cited by-同舟云学术

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Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact

Published:2017-09 Issue: Volume: Page:
ISSN:
Container-title:2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
language:
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Author:

Manessis D.¹,Pawlikowski J.¹,Ostmann A.¹,Schischke K.¹,Aschenbrenner R.¹,Schneider-Ramelow M.¹,Krivec T.²,Podhradsky G.³,Lang K-D.⁴

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration (IZM), Gustav-Meyer-Allee 25, 13355 Berlin, Germany

2. AT&S, Fabriksgasse 13, 8700 Leoben, Austria

3. SPEECH, Speech Processing Solutions GmbH, 1100 Vienna, Austria

4. Technical University Berlin, 13355 Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8337997/8346823/08346879.pdf?arnumber=8346879

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components;Journal of Electronic Packaging;2023-05-18

2. Investigations on the Robustness of a Solderless Assembled Electronic Module;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

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