Photonics IC Packaging Investigation Based on 3D Printing Approach
Author:
Affiliation:
1. UNICAMP,FEEC,Campinas,Brasil
2. CTI Renato Archer,Photonics Group,Campinas,Brasil
3. CTI Renato Archer,Packaging Division,Campinas,Brasil
Funder
São Paulo Research Foundation (FAPESP)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10560481/10560536/10560544.pdf?arnumber=10560544
Reference5 articles.
1. Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
2. Packaging investigation and study for optical interfacing of micro components with optical fibers – Part I;Mireles;Superficies y vacío
3. 3D-printing and electronic packaging
4. Development of optical fiber arrays based on silicon V-Grooves
5. Fabrication and Demonstration of a 3D-printing/PDMS Integrated Microfluidic Device
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