Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force-Reference-Cited by-同舟云学术

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Alignment and Transfer of Silver Nanowire Arrays onto Unconventional Substrates for Optoelectronic Devices via Dielectrophoresis Force

Published:2024-04-17 Issue: Volume: Page:255-256
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
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Author:

Chen Yen-Shuo¹,Liu Shun-Yu¹,Lin Ching-Chang²,Fan Hua-Tai¹,Ko Yu-Chien³,Chen Chun-Chi⁴,Ko Fu-Hsiang¹

Affiliation:

1. National Yang Ming Chiao Tung University,Department of Materials Science and Engineering

2. The University of Tokyo,Department of General System Studies

3. Institute of Pioneer Semiconductor Innovation, National Yang Ming Chiao Tung University

4. Taiwan Semiconductor Research Institute

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535648.pdf?arnumber=10535648

Reference2 articles.

1. Simulation and Experimental Study of Nanowire Assembly by Dielectrophoresis

2. Dielectrophoretic Assembly of Nanowires

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