Laser Applications in Power Management IC Packaging
Author:
Affiliation:
1. I-Shou University,Department of Industrial Management,Kaohsiung,Taiwan,84001
2. I-Shou University,Department of Mechanical and Automation Engineering,Kaohsiung,Taiwan,84001
3. E&R Engineering Corporation,Kaohsiung,Taiwan,82445
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535597.pdf?arnumber=10535597
Reference5 articles.
1. Designing Packaging for Modern Power-Conversion Applications;Di,2023
2. Laser removal of molded flashes from a leadframe heatsink surface
3. Excimer Laser Applications in Integrated Circuit Packaging
4. Direct optical wire bonding through open-to-air polymerization for silicon photonic chips
5. New laser technology for wire bonding in power devices
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