Low Thermal Resistance Joint Using Lotus-type Cu/Solder Composite-Reference-Cited by-同舟云学术

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Low Thermal Resistance Joint Using Lotus-type Cu/Solder Composite

Published:2024-04-17 Issue: Volume: Page:51-52
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Tatsumi Hiroaki¹,Isono Hiroshi²,Hirase Kana³,Ide Takuya⁴,Nishikawa Hiroshi¹

Affiliation:

1. Joining and Welding Research Institute, Osaka University,Osaka,Japan,567-0047

2. Shiima Electronics, Inc.,Kanagawa,Japan,231-0063

3. Graduate School of Engineering, Osaka University,Osaka,Japan,567-0047

4. Lotus Thermal Solution, Inc.,Osaka,Japan,530-0001

Funder

JSPS KAKENHI

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535580.pdf?arnumber=10535580

Reference5 articles.

1. Thermal management of automotive SiC-based on-board inverter with 500 W/cm² in heat flux, and Two-phase immersion cooling by breathing phenomenon spontaneously induced by lotus porous copper jointed onto a grooved heat transfer surface

2. Die Attach Materials for High Temperature Applications: A Review

3. Measurement and modeling of the effective thermal conductivity of sintered silver pastes

4. Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging

5. Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate

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