Effects of the Nanoporous Cu Interlayer on the Bonding Area and Strength for Applications in Packaging of High Power Devices
Author:
Affiliation:
1. National Yang Ming Chiao Tung University,Department of Materials Science and Engineering,Hsinchu City,Taiwan (R.O.C.),300093
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535610.pdf?arnumber=10535610
Reference4 articles.
1. Novel nanostructured thermal interface materials: a review
2. A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu–Zn
3. Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
4. Modulation of Crystallographic Texture and Twinning Structure of Cu Nanowires by Electrodeposition
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