TGV drilling by Ultrafast Laser with Hollow Beam Optics
Author:
Affiliation:
1. I-Shou University,Department of Industrial Management,Kaohsiung,Taiwan,84001
2. I-Shou University,Department of Mechanical and Automation Engineering,Kaohsiung,Taiwan,84001
3. E&R Engineering Corporation,Kaohsiung,Taiwan,82445
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535607.pdf?arnumber=10535607
Reference5 articles.
1. Through Glass Via (TGV) Technology for RF Applications;Yun
2. Fabrication of high-aspect ratio, micro-fluidic channels and tunnels using femtosecond laser pulses and chemical etching
3. Diffraction-free beams
4. A Review of Wet Chemical Etching of Glasses in Hydrofluoric Acid based Solution for Thin Film Silicon Solar Cell Application;Park;Current Photovoltaic Research,2017
5. Hollow Bessel beams for guiding atoms between vacuum chambers: a proposal and efficiency study
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