Ultra-low inductive power module design with integrated common mode noise shielding
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8081747/8098914/08098946.pdf?arnumber=8098946
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. New Design Concepts for PCB-Integration Technology in Power Electronics reducing Circuit Parasitics to a Minimum;2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM);2023-02-01
3. EMI Mitigation for SiC MOSFET Power Modules Using Integrated Common-Mode Screen;IEEE Open Journal of Power Electronics;2023
4. Electro-Thermal Optimization of Common-Mode Screen for Organic Substrate-Based SiC Power Module;2022 IEEE Energy Conversion Congress and Exposition (ECCE);2022-10-09
5. Comparison Study of Parasitic Inductance, Capacitance and Thermal Resistance for Various SiC Packaging Structures;2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia);2021-08-25
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