Ultra-broadband SIW Diplexer on low-cost Laminate Technology for Channel Bonding D-band Front Ends
Author:
Affiliation:
1. Université Grenoble-Alpes, CEA-Leti, Minatec Campus,Grenoble,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9784154/9783612/09784167.pdf?arnumber=9784167
Reference5 articles.
1. Microstrip multiplexer with four channels for broadband system applications
2. Submillimeter wave manifold diplexer designed in 65 nm CMOS
3. Design of Ring-Manifold Microwave Multiplexers
4. A D-band 4-ways power splitter/combiner implemented in the BEOL of a 28nm bulk CMOS process;barrera;European Microwave Conference,0
5. A 150 GHz Amplifier With 8 dB Gain and $+$6 dBm $P_{\rm sat}$ in Digital 65 nm CMOS Using Dummy-Prefilled Microstrip Lines
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