An Experimental Investigation of a Flexible Sintered Silver Joint for Micro-Joining Based on a Design of Experiments
Author:
Affiliation:
1. VALEO,THS Material Laboratory,La Verrière,France,78321
2. Universite de Versailles SQY-Paris Saclay,LISV,Vélizy,France,78321
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418383.pdf?arnumber=10418383
Reference11 articles.
1. Lead-free Solders in Microelectronics
2. Effects of voids on thermal-mechanical reliability of lead-free solder joints
3. Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
4. Low-temperature low-pressure die attach with hybrid silver particle paste
5. Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging
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