Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
Author:
Affiliation:
1. Institute of Electronic Packaging Technology, Technical University of Dresden,Dresden,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418428.pdf?arnumber=10418428
Reference7 articles.
1. Moore's law: past, present and future
2. On-Chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes
3. Hybrid lithography approach for single mode polymeric waveguides and out-of-plane coupling mirrors
4. Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL;Karppinen
5. Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp
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