High-Baudrate SiP and InP Modulators for Data Center Interconnects-Reference-Cited by-同舟云学术

High-Baudrate SiP and InP Modulators for Data Center Interconnects

Published:2023-09-21 Issue: Volume: Page:
ISSN:
Container-title:2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM)
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Author:

Ozolins Oskars¹,Ostrovskis Armands²,Salgals Toms²,Krüger Benjamin³,Pittalà Fabio³,Joharifar Mahdieh⁴,Schatz Richard⁴,Koenigsmann Michael³,Fan Yuchuan⁵,Westergren Urban⁴,Mardoyan Haik⁶,Zhang Lu⁷,Spolitis Sandis²,Yu Xianbin⁷,Gruen Markus³,Bobrovs Vjaceslavs¹,Louchet Hadrien³,Pang Xiaodan⁴

Affiliation:

1. Institute of Telecommunications, Riga Technical University,Riga,Latvia

2. Riga Technical University,Institute of Telecommunications and Communication Technologies Research Center,Riga,Latvia

3. Keysight Technologies Deutschland GmbH,Böblingen,Germany

4. KTH Royal Institute of Technology,Department of Applied Physics,Stockholm,Sweden

5. RISE Research Institutes of Sweden,Kista,Sweden

6. Nokia Bell Labs,Route de Villejust Nozay,France

7. Zhejiang University, and Zhejiang Lab,Hangzhou,China

Funder

National Natural Science Foundation of China

China Scholarship Council

National Key Research and Development Program of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10271384/10271386/10271574.pdf?arnumber=10271574

Reference9 articles.

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2. 240/160 Gbaud OOK Silicon Photonics MZM/RRM Transmitters for Short-Reach Applications

3. Optical Amplification-Free 200 Gbaud On-Off Keying Link for Intra-Data Center Communications

4. TFLN MZMs and Next-Gen DACs: Enabling Beyond 400 Gbps IMDD O-Band and C-Band Transmission

5. A 224 Gb/s per Channel PAM4 DR4-Tx Optical SubSystem Based on Si Micro-Ring Modulator with Hybrid Integrated Laser and SOA;wang;IEEE SiPhotonics 2023,2023