Power Losses of Advanced MMC Submodule Topologies Using Si- and SiC-Semiconductors
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/8895670/8914733/08915430.pdf?arnumber=8915430
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. A Hybrid Multilevel Converter Topology Based on NPC and CHB Series and Its Control Method;2022 4th International Conference on Smart Power & Internet Energy Systems (SPIES);2022-12-09
3. A hybrid MMC with SiC-based Full-bridge and Si-based Half-Bridge Sub-Modules with Novel Voltage Sorting Scheme;2022 IEEE Applied Power Electronics Conference and Exposition (APEC);2022-03-20
4. A Highly Efficient Hybrid Devices-based MMC with a Novel Modulation Scheme Using Hardware-in- Loop System;2022 IEEE Applied Power Electronics Conference and Exposition (APEC);2022-03-20
5. Optimization of the chip area in 3.3 kV SiC submodules for HVDC converters;2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe);2021-09-06
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