Author:
Iwahashi Seita,Otsuka Takukazu,Nakamura Takashi
Cited by
2 articles.
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1. Warpage of transfer-molded automotive power modules – experimental characterization, numerical simulation and optimization;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07