Low-Loss, High Extinction Ratio Fiber to Chip Connection via Laser Fusion for Polarization Maintaining Fibers
Author:
Affiliation:
1. University of Rochester,The Institute of Optics,Rochester,New York,USA,14627
2. University of Rochester,Department of Electrical Engineering,Rochester,New York,USA,14620
Funder
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10115459/10115461/10117121.pdf?arnumber=10117121
Reference8 articles.
1. Fiber-to-chip fusion splicing for low-loss photonic packaging
2. Vertical Optical Fiber Assembly on Silicon Photonic Chips Using 3D-Curved Silicon Waveguide Couplers
3. Optical Networking Beyond WDM
4. A Fully Integrated 25 Gb/s Si Ring Modulator Transmitter with a Temperature Controller
5. Packaging Process for Grating-Coupled Silicon Photonic Waveguides Using Angle-Polished Fibers;snyder;IEEE Transactions on Components Packaging and Manufacturing Technology,2013
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