Developments of VCSEL-based transceivers for Co-Packaging
Author:
Affiliation:
1. IBM T. J. Watson Research Center,Yorktown Heights,NY,USA,10598
Funder
Advanced Research Projects Agency
U.S. Department of Energy
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10115459/10115461/10116922.pdf?arnumber=10116922
Reference15 articles.
1. Polarization-stable 940nm VCSELs for sparing (Conference Presentation)
2. Co-Packaging on Organic Laminates: MOTION Phase 2;kuchta,0
3. Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
4. An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing;kuchta;2022 European Conference on Optical Communications (ECOC),0
5. Multi-wavelength Optical Transceivers Integrated on Node (MOTION)
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