Foundry’s Perspective on Laser and SOA Module Integration with Si-Photonics
Author:
Affiliation:
1. Advanced Micro Foundry Pte Ltd,Science Park II,Singapore,117685
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10115459/10115461/10116764.pdf?arnumber=10116764
Reference10 articles.
1. Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser
2. Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate;keyvaninia et al;Opt Mater Express,2013
3. High-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology
4. Electrically pumped continuous-wave III–V quantum dot lasers on silicon
5. Lasing in direct-bandgap GeSn alloy grown on Si
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