3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration
Author:
Affiliation:
1. Skorpios Technologies Inc,Austin,TX,78741
2. Meta Platforms, Inc,Menlo Park,CA,94025
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10115459/10115461/10116222.pdf?arnumber=10116222
Reference7 articles.
1. A CMOS Wafer-Scale, Monolithically Integrated WDM Platform for TB/s Optical Interconnects;li;Optical Fiber Communication Conference (Optical Society of America 2014),2011
2. External vs. Integrated Light Sources for Intra-Data Center Co-Packaged Optical Interfaces
3. 3.2T-Copackaged-Optics-ModulePRD-1.0;document,2021
4. Progress in Low-Power Switched Optical Interconnects
5. Silicon Photonics-Based 100 Gbit/s, PAM4, DWDM Data Center Interconnects
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