A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit-Reference-Cited by-同舟云学术

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A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit

Published:2023-03 Issue: Volume: Page:
ISSN:
Container-title:2023 Optical Fiber Communications Conference and Exhibition (OFC)
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Author:

Samanta Anirban¹,Chang Po-Hsuan²,Yan Peng²,Fu Mingye¹,Berkay-On Mehmet¹,Kumar Ankur²,Kang Hyungryul²,Yi Il-Min²,Annabattuni Dedeepya²,Zhang Yu¹,Scott David³,Patti Robert⁴,Fan Yang-Hang²,Zhu Yuanming²,Palermo Samuel²,Ben Yoo S.J.¹

Affiliation:

1. University of California, Davis,Department of Electrical and Computer Engineering,Davis,California

2. Texas A&M University,Analog & Mixed-Signal Center,College Station,Texas

3. Optelligent,Costa Mesa,California

4. Nhanced Semiconductors,Batavia,Illinois

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10115459/10115461/10116163.pdf?arnumber=10116163

Reference7 articles.

1. Design of a 50-Gb/s Hybrid Integrated Si-Photonic Optical Link in 16-nm FinFET

2. A Monolithically-Integrated Chip-to-Chip Optical Link in Bulk CMOS

3. CMOS Transceiver Circuits for Energy Efficient Silicon Photonic Interconnects;yan;European Conference on Optical Communication (ECOC),2022

4. Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits

5. Petabit-Scale Silicon Photonic Interconnects With Integrated Kerr Frequency Combs;rizzo;IEEE Journal of Selected Topics in Quantum Electronics,2022

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