Throughput Maximization for Intelligent Reflecting Surface-Aided Device-to-Device Communications System-Reference-Cited by-同舟云学术

Throughput Maximization for Intelligent Reflecting Surface-Aided Device-to-Device Communications System

Published:2020-12 Issue:4 Volume:5 Page:403-410
ISSN:2096-1081
Container-title:Journal of Communications and Information Networks
language:
Short-container-title:J. Commun. Inf. Netw.

Author:

Zhang Chiya¹,Chen Wenyu²,He Chunlong²,Li Xingquan²

Affiliation:

1. School of Electronic and Information Engineering, Harbin Institute of Technology, Shenzhen 518055, China. Peng Cheng Laboratory (PCL), Shenzhen 5180523, China

2. Guangdong Key Laboratory of Intelligent Information Processing, Shenzhen University, Shenzhen, 518060, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Networks and Communications

Link

http://xplorestaging.ieee.org/ielx7/8892389/9306008/09306014.pdf?arnumber=9306014

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