Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions-Reference-Cited by-同舟云学术

Physical and Functional Reverse Engineering Challenges for Advanced Semiconductor Solutions

Published:2022-03-14 Issue: Volume: Page:
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Container-title:2022 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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Author:

Lippmann Bernhard¹,Bette Ann-Christin¹,Ludwig Matthias¹,Mutter Johannes¹,Baehr Johanna²,Hepp Alexander²,Gieser Horst³,Kovac Nicola³,Zweifel Tobias³,Rasche Martin⁴,Kellermann Oliver⁴

Affiliation:

1. Infineon Technologies AG,Munich,Germany

2. Technical University of Munich,Department of Electrical and Computer Engineering,Munich,Germany

3. Fraunhofer EMFT,Munich,Germany

4. Raith GmbH,Dortmund,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9774496/9774497/09774610.pdf?arnumber=9774610

Reference24 articles.

1. Practical Partial Hardware Reverse Engineering Analysis

2. Hardware Trust and Assurance through Reverse Engineering: A Tutorial and Outlook from Image Analysis and Machine Learning Perspectives

3. FIDES, Know-how-Schutz und Identifizierbarkeit von Elektronikkomponen-ten für vertrauenswürdige Produktionskette;Bundesministerium für Bildung und Forschung,0

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