Platinum interconnections for harsh environment applications using atmospheric pressure sputtering-Reference-Cited by-同舟云学术

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Platinum interconnections for harsh environment applications using atmospheric pressure sputtering

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 International Conference on Electronics Packaging (ICEP)
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Author:

Bickel J.¹,Schneider-Ramelow M.²,Lang K.-D.²,Gesche R.³,Ngo H.-D.¹

Affiliation:

1. University of Applied Sciences,Berlin,Germany

2. Fraunhofer IZM,Berlin,Germany

3. Beaplas GmbH,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795437.pdf?arnumber=9795437

Reference8 articles.

1. 555-Timer and Comparators Operational at 500 °C

2. Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

3. Additive Technologies for Ceramic MEMS Sensors

4. Schichtanalyse des partiellen Atmosphärendrucksputterns für Hoch-temperatur - Packaging – Anwendungen;bickel;Der MikroSystemTechnik Kongress 2019,2019

5. Evaluation of Nanoparticle Inks on Flexible and Stretchable Substrates for Biocompatible Application

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Plasma‐Based Additive Manufacturing Method for MEMS Using APSLD (Atmospheric Pressure Sputtering Layer Deposition) Technology†;IEEJ Transactions on Electrical and Electronic Engineering;2024-03-04

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