Manufacture of high-strength differential pressure sensor using SiCer technology-Reference-Cited by-同舟云学术

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Manufacture of high-strength differential pressure sensor using SiCer technology

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 International Conference on Electronics Packaging (ICEP)
language:
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Author:

Kleinholz C.¹,Cyriax A.²,Hintz M.²,Muller J.¹,Ortlepp T.²

Affiliation:

1. Technische Universität Ilmenau,Electronics Technology Group,Ilmenau,Germany,98693

2. CiS Forschungsinstitut für Mikrosensorik GmbH,Erfurt,Germany,99099

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795558.pdf?arnumber=9795558

Reference4 articles.

1. Herstellung und Charakterisierung von SiCer basierten Drucksensoren;kleinholz;2 HIPS Statusworkshop,2021

2. Implementation of SiCer technology for pressure sensor applications;kleinholz;CICMT,2021

3. Anwendung von SiCer-Substraten bei Drucksensoren;cyriax;1 HIPS Statusworkshop,2021

4. Einsatz von SiCer-Verbundsubstraten für Drucksensoren;kleinholz;CiS MEMS Workshop,2020

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

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