A Study on Strengthening Mechanisms in Sn-0.7Cu via Microstructural Observation, Elemental Distribution, and Grain-Size Analysis
Author:
Affiliation:
1. Feng Chia University,Department of Materials Science and Engineering,Taichung,Taiwan (R.O.C.)
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795497.pdf?arnumber=9795497
Reference8 articles.
1. Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging
2. Fast dissolution and soldering reactions on Au foils
3. Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder
4. 4 - Strengthening of metal alloys;mouritz;Introduction to Aerospace Matarials,2012
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1. Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging;JOM;2023-08-24
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