Physical implementation of 3D integrated solenoids within silicon substrate for hybrid IC applications-Reference-Cited by-同舟云学术

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Physical implementation of 3D integrated solenoids within silicon substrate for hybrid IC applications

Published:2009-09 Issue: Volume: Page:
ISSN:
Container-title:2009 European Microwave Conference (EuMC)
language:
Short-container-title:

Author:

Duplessis M.¹,Tesson O.¹,Neuilly F.²,Tenailleau J.R.²,Descamps P.³

Affiliation:

1. NXP Semiconductors, 2 Esplanade Anton Philips, Campus Effiscience, Colombelles BP 20000, 14906 Caen, Cedex 9, France

2. IPDiA, 2 rue de la Girafe, 14000 Caen, France

3. LaMIPS, Laboratoire commun NXP-CRISMAT, UMR 6508 CNRS ENSICAEN UCBN, 2, rue de la Girafe BP 5120, F-14079 Caen Cedex 5, France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5286913/5295900/05295975.pdf?arnumber=5295975

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