Observation of Readout Temperature Dependence and Its Variability for the MEMS and ASIC System Specimens and Their PCB Testbenches-Reference-Cited by-同舟云学术

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Observation of Readout Temperature Dependence and Its Variability for the MEMS and ASIC System Specimens and Their PCB Testbenches

Published:2022-06-23 Issue: Volume: Page:
ISSN:
Container-title:2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)
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Author:

Jankowski Mariusz¹,Nazdrowicz Jacek¹,Zajac Piotr¹,Amrozik Piotr¹,Szermer Michal¹,Maj Cezary¹,Jablonski Grzegorz¹

Affiliation:

1. Lodz University of Technology,Department of Microelectronics and Computer Science,Lodz,Poland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9837956/9837957/09837994.pdf?arnumber=9837994

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Statistical Analysis of the Functioning of the Inertial Acceleration Sensor in a Variable Temperature Environment;2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES);2024-06-27

2. Influence of temperature on the quality of operation of an analog reading system for MEMS structures;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

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