Author:
Bhogaraju Sri Krishna,Schmid Maximilian,Kotadia Hiren R,Conti Fosca,Elger Gordon
Cited by
3 articles.
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1. Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
2. Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
3. Low cost copper based sintered interconnect material for optoelectronics packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05