Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate-Reference-Cited by-同舟云学术

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Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Published:2023-04-19 Issue: Volume: Page:
ISSN:
Container-title:2023 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Zhao Shuaijie¹,Chen Chuantong¹,Ueshima Minoru²,Haga Motoharu²,Suganuma Katsuaki¹

Affiliation:

1. Osaka University,SANKEN,Ibaraki,Osaka,Japan

2. Daicel Corporation,Osaka,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129766.pdf?arnumber=10129766

Reference3 articles.

1. Influence of Composition, Humidity, and Temperature on Chemical Aging in Epoxies: A Local Study of the Interphase with Air

2. Master decomposition curve analysis of ethylene vinyl acetate pyrolysis: influence of metal powders

3. Diffusion of metals in polymers

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Brief Overview on Epoxies in Electronics: Properties, Applications, and Modifications;Polymers;2023-09-30

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