Assembly and packaging technology on Silicon-Ceramic-based composite substrates
Author:
Affiliation:
1. Technische Universität Ilmenau,Electronics Technology Group,Department of Electrical Engineering and Information Technology,Ilmenau,Germany,98693
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129654.pdf?arnumber=10129654
Reference2 articles.
1. Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration
2. Microwave multichip module tridimensional assembly technology based on LTCC
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1. Reliability Study of Ag through via Interconnects for Integrated Horn Antennas in LTCC Substrates;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. Surface Manipulation of Ag Metallization to Improve the Adhesion Strength for Soldering Applications on LTCC;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
3. Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
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