Hybrid Surface Treatment for Copper-to-Copper Thermal Compression Bonding Thermal Compression Bonding
Author:
Affiliation:
1. National Chung Hsing University,Department of Materials Science and Engineering,Taichung,Taiwan
2. Advanced Semiconductor Engineering Group,Kaohsiung,Taiwan,811
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129664.pdf?arnumber=10129664
Reference4 articles.
1. Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
2. Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding
3. Microstructure evolution and abnormal grain growth during copper wafer bonding
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