The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications-Reference-Cited by-同舟云学术

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The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications

Published:2024-01-29 Issue: Volume: Page:1-6
ISSN:
Container-title:2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)
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Author:

Hein Verena¹,Weide-Zaage Kirsten²,Clausner André³

Affiliation:

1. X-FAB Global Services GmbH,Erfurt,Germany

2. RESRI Group, Institute of Microelectronic Systems (IMS), Leibniz Universität Hannover,Hannover,Germany

3. Fraunhofer-Institut für Keramische Technologien und Systeme IKTS, Microelectronic Materials and Nanoanalysis,Dresden,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10436504/10436439/10436520.pdf?arnumber=10436520

Reference12 articles.

1. Differences in reliability effects for thick copper and thick aluminium metallizations

2. Process, Geometry and Stack Related Reliability of Thick AlCu-Metal-Tracks;Hein

3. JEDEC Solid State Technology Association;JPOO1A,2014

4. Electromigration—A brief survey and some recent results

5. High-resolution in-situ of gold electromigration: test time reduction

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