Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors-Reference-Cited by-同舟云学术

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Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors

Published:2024-02 Issue:2 Volume:E107-B Page:309-320
ISSN:1745-1345
Container-title:IEICE Transactions on Communications
language:
Short-container-title:IEICE Trans. Commun.

Author:

Urakami Taisei¹,Maruyama Tamami²,Nishiyama Shimpei³,Kusamizu Manato³,Ono Akira³,Shiozawa Takahiro⁴

Affiliation:

1. Nara Institute of Science and Technology,Ikoma-shi,Japan,630-0192

2. National Institute of Technology (KOSEN), Hakodate College,Hakodate-shi,Japan,042-8501

3. National Institute of Technology (KOSEN), Kagawa College,Mitoyo-shi,Japan,769-1192

4. Toyo University,Kawagoe-shi,Japan,350-8585

Funder

JSPS

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/10400553/10440605/10400557.pdf?arnumber=10400557

Reference43 articles.

1. Millimeter Wave Mobile Communications for 5G Cellular: It Will Work!

2. Coverage Enhancement for NLOS mmWave Links Using Passive Reflectors

3. An Effective Coverage Scheme With Passive-Reflectors for Urban Millimeter-Wave Communication

4. Design of millimeter wave microstrip reflectarrays

5. Frequency Selective Reflectarray Using Crossed-Dipole Elements With Square Loops for Wireless Communication Applications

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