Investigation of Surface Temperature for Sensitive Element of Micromechanical Accelerometer During Plasma Etching Using Finite Element Method
Author:
Affiliation:
1. JSC,Concern CSRI Elektropribor,Saint Petersburg,Russia
2. JSC ITMO University,Concern CSRI Elektropribor,Saint Petersburg,Russia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10168302/10168309/10168369.pdf?arnumber=10168369
Reference11 articles.
1. A Heat Flux Microsensor for Direct Measurements in Plasma Surface Interactions
2. The energy balance at substrate surfaces during plasma processing
3. Improving the Etching Performance of High-Aspect-Ratio Contacts by Wafer Temperature Control–Uniform Temperature Design and Etching Rate Enhancement;tandou;Precision Engineering,2015
4. Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma
5. Aspect ratio dependent etching lag reduction in deep silicon etch processes
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