Sub-THz Substrate Integrated Waveguide Signal Transitions in Backend-of-Line of a Silicon Process-Reference-Cited by-同舟云学术

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Sub-THz Substrate Integrated Waveguide Signal Transitions in Backend-of-Line of a Silicon Process

Published:2024-03-17 Issue: Volume: Page:1-5
ISSN:
Container-title:2024 18th European Conference on Antennas and Propagation (EuCAP)
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Author:

Bhutani A.¹,Kaynak M.²,Wietstruck M.³,Bekker E.¹,Aksoyak I. K.¹,Hebeler J.¹,Zwick T.¹

Affiliation:

1. Institute of Radio Frequency Engineering and Electronics, Karlsruhe Institute of Technology,Karlsruhe,Germany,76131

2. IHP - Leibniz-Institut für innovative Mikroelektronik,Frankfurt (Oder),Germany,15236

3. Texas Instruments,Kilby Labs,Dallas,TX,USA,75243

Funder

Federal Ministry of Education and Research (BMBF), Germany under the project ESSENCE-6GM

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10500901/10500902/10501393.pdf?arnumber=10501393

Reference22 articles.

1. The EU DOTSEVEN Project: Overview and Results

2. Electromagnetic coupling and radiation loss considerations in microstrip (M)MIC design

3. Attenuation characteristics of coplanar waveguides at subterahertz frequencies

4. Modeling dispersion and radiation characteristics of conductor-backed CPW with finite ground width

5. Improved Modeling of Radiation Effects in Coplanar Waveguides with Finite Ground Width

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