Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias-Reference-Cited by-同舟云学术

Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias

Published:2023-03 Issue:2 Volume:32 Page:365-374
ISSN:2075-5597
Container-title:Chinese Journal of Electronics
language:
Short-container-title:Chinese J. Elect.

Author:

Yin Xiangkun¹,Wang Fengjuan²,Zhu Zhangming¹,Pavlidis Vasilis F.³,Liu Xiaoxian¹,Lu Qijun¹,Liu Yang¹,Yang Yintang¹

Affiliation:

1. Shaanxi Key Lab. of Integrated Circuits and Systems, School of Microelectronics, Xidian University,Xi'an,China,710071

2. School of Automation and Information Engineering, Xi'an University of Technique,Xi'an,China,710048

3. University of Manchester,Department of Computer Science,Manchester,UK,M139PL

Funder

Fok Ying Tung Education Foundation

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Applied Mathematics,Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/9970761/10038790/10038820.pdf?arnumber=10038820

Reference24 articles.

1. Physical implementation of 3D integrated solenoids within silicon sub-strate of hybrid IC applications;duplessis;Proceedings of 39th European Microwave Conference,2009

2. Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

3. Modeling of TSV-based solenoid inductors for 3-D integration

4. Transient Analysis of TSV Equivalent Circuit Considering Nonlinear MOS Capacitance Effects

5. Accurate Inductance Modeling of 3-D Inductor Based on TSV

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1. A novel annular through-silicon-vias in 3D-ICs;2023 9th International Conference on Computer and Communications (ICCC);2023-12-08