Corrosion problems in electronic systems
Author:
Publisher
Centre for Evaluation in Education and Science (CEON/CEES)
Subject
General Materials Science
Link
https://scindeks-clanci.ceon.rs/data/pdf/0351-9465/2019/0351-94651903259S.pdf
Reference30 articles.
1. S.Manoharan, C.Patel, P.McCluskey (2017) Advancements in silver wire bonding, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems;
2. R.Asmatulu, S.I.Khan, M.L.Jenkinson (2016) Improving corrosion resistance via graphene nanocomposite coatings, Graphene Science Handbook: Size-Dependent Properties, 467-478;
3. L.M.Toscano, E.Long (2015) A new surface finish for the electronics industry: Electroless nickel/immersion silver, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 -Proceedings 7048458, 372-378;
4. Y.Li, G.Fu (2014) The influence of autoclave on plastic encapsulated microcircuit, Proceedings of 2014 Prognostics and System Health Management Conference, PHM 20146988144, 112-116;
5. W.Wang, H.Zhang, Z.Wang (2014) Progress in magnesium alloys reinforced by long period stacking ordered structure, Xiyou Jinshu/Chinese Journal of Rare Metals, 38(1), 138-145;
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3