Quantitative Evaluation of Factors in the Adhesion Strength of Ni Thin Film Formed by Electroless Plating on ABS Resin-Reference-Cited by-同舟云学术

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Quantitative Evaluation of Factors in the Adhesion Strength of Ni Thin Film Formed by Electroless Plating on ABS Resin

Published:2019-05-05 Issue:5 Volume:68 Page:307-314
ISSN:0525-1931
Container-title:BUNSEKI KAGAKU
language:en
Short-container-title:Bunseki kagaku

Author:

YAGI Yusuke¹,AMANO Kumi¹,MITSUOKA Takuya¹,KATO Yuichi¹

Affiliation:

1. TOYOTA CENTRAL R&D LABS., INC.

Publisher

Japan Society for Analytical Chemistry

Subject

Analytical Chemistry

Link

https://www.jstage.jst.go.jp/article/bunsekikagaku/68/5/68_307/_pdf

Reference3 articles.

1. 6) K. Heymann, W. Riedel, G. Woldt : “Metallische Ueberzuege auf Kunstoffen”, p. 48 (1966), (Carl Hanser Verlag).

2. 7) E. B. Saubestre, L. J. Durney, J. Hajdu, E. Bastenbeck : Plating, 52, 982 (1965).

3. 13) J. G. Bokria, S. Schlick : Polymer, 43, 11 (2002).

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Plating Pretreatment method by expansion and destruction of the Glass Filler of Polyphenylene Sulfide（PPS）Resin Composites;Journal of The Surface Finishing Society of Japan;2024-09-01

2. Enhanced adhesion of copper plating to polyether ether ketone based on active oxygen species generated under ultraviolet irradiation;Surface and Interface Analysis;2022-03-20

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