Analysis of the stress-strain state of copper M0B under different schemes of equal channel angular pressing and its effect on the structure and physical and mechanical properties-Reference-Cited by-同舟云学术

Analysis of the stress-strain state of copper M0B under different schemes of equal channel angular pressing and its effect on the structure and physical and mechanical properties

Published:2019-08-10 Issue:1(97) Volume: Page:47-53
ISSN:1994-6716
Container-title:Voprosy Materialovedeniya
language:
Short-container-title:Vopr. materialoved.

Author:

Sennikova L. F.¹,Volkova G. K.¹,Tkachenko V. M.¹

Affiliation:

1. Dоnetsk Institute for Physics and Engineering named after A.A. Galkin (DonIPE) of the National Academy of Sciences of Ukraine

Abstract

The results of studies of the stress-strain state of copper M0b after deformation under different schemes of equal channel angular pressing (ECAP) are presented. The level of macro and micro stresses in copper has been determined in various ECAP modes. It is shown that the strength properties, deformation porosity and parameters of the fine copper structure differ depending on the loading pattern.

Publisher

FSUE CRISM Prometey

Reference8 articles.

1. Valiev, V.Z., Aleksandrov, I.V., Nanostrukturnye materialy, poluchennye intensivnoi plasticheskoi deformatsiei [Nanostructured materials obtained using intensive plastic deformation], Moscow: Logos, 2000, p. 272.

2. Rybin, V.V., Bolshie plasticheskie deformatsii i razrushenie metallov [Big plastic deformation and destruction of metals], Moscow: Metallurgiya, 1986, p. 223.

3. Cheremskoy, P.G., Slezov, V.V., Betekhin, V.I., Pory v tverdom tele [Pores in solid body], Moscow: Energoatomizdat, 1990, p. 376.

4. Umansky, Ya.S., Skakov, Yu.A., Ivanov, A.N., Rastorguev, L.N., Kristallografiya, rentgenografiya i elektronnaya mikroskopiya [Crystalography, roentgenography and electronic microscopy], Moscow: Metallurgiya, 1982, p. 631.

5. Rusakov, A.A., Rentgenografiya metallov [Roentgenography of metals], Moscow: Atomizdat, 1977, p. 479.