Study on optimal size of repeater insertion with ununiform temperature distribution
-
Published:2012
Issue:5
Volume:61
Page:054102
-
ISSN:1000-3290
-
Container-title:Acta Physica Sinica
-
language:
-
Short-container-title:Acta Phys. Sin.
Author:
Wang Zeng ,Dong Gang ,Yang Yin-Tang ,Li Jian-Wei , ,
Abstract
Based on the influence of nonuniform temperature distribution on interconnect delay, an analytical model to estimate the optimal size of repeaters inserting RC interconnect is presented in this paper. In the proposed analytical model the temperature distribution is taken into account and a temperature correction factor is introduced to modify the repeater size and obtain the optimal interconnect delay. Adopting parameters of 90 nm and 65 nm process technology, the proposed model is compared with the model without considering the temperature distribution. Results show that the new model is more accurate and saves the repeater insertion area with maximum values of 15.6% and 36.7% in 90 nm and 65 nm technology, respectively.
Publisher
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences
Subject
General Physics and Astronomy
Reference21 articles.
1. Morgenshtein A, Friedman E G, Cinosar R, Kolodny A 2010 IEEETrans. on Very Large Scale Integration (VLSI) Systems 18 689
2. Zeng J K, Chen C P 2010 11th Int. Symposium on ISQED p818
3. Saini S, Kumar A M, Veeramachaneni S 2010 23rd Int. Conf. onVLSI Design p411
4. El-Moursy M A, Friedman E G 2007 Integration the VLSI Journal40 461
5. Wang Z, Dong G, Yang Y T, Li J W 2011 Chin. Sci. Bull. 56617 (in Chinese) [王增, 董刚, 杨银堂, 李建伟 2011科学通报 56 617]
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献