Study on electrical performance of metal copper films deposited by magnetron sputtering on polyimide flexible substrates

Abstract

For preparing flexible copper clad laminate, copper films are deposited by magnetron sputtering on polyimide substrates. During the experiment, the prepared copper films show good conductivity while changing the technological parameter like preparation temperature, substrate bias, preparation time, and so on. The composition, structure, and surface morphology of the thin film are investigated by X-ray diffraction (XRD) and scanning electron microscope (SEM). The stylus profilometer and four-point probe resistance measuring instrument are used to examine the thickness and resistance of the thin films, and the resistivity of the film is calculated. Finally, the optimum processing conditions for the copper films are obtained according to the standard of industrial application: the preparation temperature is 100℃, the DC substrate bias is 50 V, with no pulsed substrate bias.