Design and Optimization of an Immersion Liquid Cooling System in Internet Datacenter

Abstract

With the development of high-performance chips, the heat flux of Internet datacenter (IDC) is on the rise, and heat dissipation becomes a major bottleneck of IDC development. The cooling needs of the IDC room can hardly be met by the traditional method of air cooling. In recent years, immersion liquid cooling has attracted a growing attention, due to its excellent performance. This paper designs and optimizes an immersion liquid cooling system for IDC. Multiple numerical simulations were carried out to analyze the influence of the system parameters on heat dissipation, and improve the system efficiency using a dielectric coolant. Specifically, 20 graphics processing units (GPUs) and 2 central processing units (CPUs) were set up in each machine of the liquid cooling server. Then, the GPU and CPU temperature was examined under different opening positions on the server top plate, inlet coolant temperatures, and coolant flow speeds. The results show that a 30mm-wide, 430mm-long opening should be set at the upper part of the GPU array, 20mm away from the top plate. The cooling effect can be optimized at the inlet temperature of 30℃, and the coolant flow speed of 3m3/h.