Heat Flow Field Analysis on Heat Dissipation Features of High-Wattage Power Cabinets

Abstract

With the rapid development of electronic science and technology, power electronic devices are increasingly efficient, intelligent, small, and multi-functional. To ensure the thermal reliability of these devices, it is particularly important to make a reasonable heat dissipation design. However, there is insufficient research into the precise measurement of the flow field and temperature field within real high-voltage power electronic devices under the heat dissipation state of liquid cooling. To fill the gap, this paper carries out a heat flow field analysis on the heat dissipation features of high-wattage power cabinets. Out of the multiple power electronic device groups in a typical high-wattage power cabinet, a row of power electronic device units was taken as the objects. Then, several power electronic devices were analyzed numerically to establish a thermal model of the power electronic device group. Next, we designed the dissipation structure of the group, obtained the correlation between the flow field uniformity and temperature distribution of power electronic devices, and analyzed the effects of the ambient temperature of the group, the flow rate of cooling air, and other factors on the temperature features of power electronic devices. The proposed thermal model and dissipation system design strategy were proved feasible through experiments.