Dynamic Behavior of Solder Filling during Ultrasonic Soldering
Author:
Publisher
American Welding Society
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultrarapid soldering Cf/Al by inactive solder by ultrasonic assistance;Journal of Materials Processing Technology;2024-09
2. Sn–3Ag–0.5Cu/TiO2/Ti wire-tube structure with memristive response by ultrasonic soldering;Journal of Alloys and Compounds;2024-03
3. Ultrasonic-based surface patterning and interfacial reaction of ZrO2 ceramics;Journal of Materials Science & Technology;2023-08
4. The Horizontal Sonocapillary Effect in UltrasonicAssisted Soldering;Welding Journal;2023-06-01
5. Fabricating porous Si3N4 ceramics joint by ultrasonic brazing at 450 °C;Materials Characterization;2023-02
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