Effect of Dimple Arrangement on The Thermal Performance of Dimpled Stepped Plate Heat Sink

Abstract

Thermal management of electronic devices is the biggest problem in the electronic industry today. Heat sinks are one such devices that are used to cater this need and addition of dimples to these devices are proved to improve the thermal performance further. In the present study, computational analysis is carried out for comparing the stepped fin heat sinks with inline and staggered dimple arrangements having same number of dimples on each fin plate at velocities in the range of 0.5m/s to 4.5 m/s for 9 cases. The results of the computational study are validated by comparing it with the experimental results of previous literature. The outcomes reveal that there is negligible difference in thermal performance of the two heat sinks at lower velocities and this gap widens with increase in velocity. Out of the two-heat sink model, heat sink with inline arranged dimples proved to have better thermal performance at all the velocities considered.