1. P. Borgesen, C.Y. Li, H.D. Conway, Mechanical design considerations for area array solder joints. IEEE Trans. Comp., Hybrids, Manuf. Technol. 16(3), 272–283 (1993)
2. Borgesen, P., Bolton, S. C., Yost, B., Maggard, J. G., Brown, D. D., and Li, C.-Y., 1993, Effects of Composition on Fatigue Crack Growth Rates in Area Array Solder Joints. In : P. A. Engel, W. T. Chen (eds). Advances in Electronic Packaging, pp. 969–977.
3. S.M. Heinrich, Selection of design and process parameters for non-uniform ball grid arrays. Adv. Elec. Pack. 1(1), 273–288 (1995)
4. Marrs, R. C., and Olachea, G., 1994, BGAs for MCMs. Advanced Packaging, September/October, pp. 48–52.
5. Y.C. Lee, W.T. Chen, Manufacturing Challenges in Electronic Packaging (Chapman & Hall, London, 1998)