Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions-Reference-Cited by-同舟云学术

Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions

Published:2021-09-24 Issue:39 Volume:7 Page:
ISSN:2375-2548
Container-title:Science Advances
language:en
Short-container-title:Sci. Adv.

Author:

Cheng Yang¹²^ORCID,Li Xuanyang¹^ORCID,Qin Yixiu³^ORCID,Fang Yuting⁴^ORCID,Liu Guanglei¹²^ORCID,Wang Zengyao¹^ORCID,Matz John⁵^ORCID,Dong Pei⁵^ORCID,Shen Jianfeng¹^ORCID,Ye Mingxin¹^ORCID

Affiliation:

1. Institute of Special Materials and Technology, Fudan University, Shanghai, P. R. China.

2. Department of Materials Science, Fudan University, Shanghai, P. R. China.

3. State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai, P. R. China.

4. State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University, Shanghai, PR China.

5. Department of Mechanical Engineering, George Mason University, Fairfax, VA 22030, USA.

Abstract

Hierarchical polyimide/Ti 3 C 2 T x film enables highly efficient and stable electromagnetic interference shielding.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference63 articles.

1. Assessing Human Exposure to Electromagnetic Fields From Wireless Power Transmission Systems

2. Human disease resulting from exposure to electromagnetic fields1)

3. 2D MXenes for Electromagnetic Shielding: A Review

4. Beyond Ti3C2Tx: MXenes for Electromagnetic Interference Shielding

5. 2D titanium carbide (MXene) for wireless communication

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