Self-assembly of highly sensitive 3D magnetic field vector angular encoders-Reference-Cited by-同舟云学术

Self-assembly of highly sensitive 3D magnetic field vector angular encoders

Published:2019-12-06 Issue:12 Volume:5 Page:
ISSN:2375-2548
Container-title:Science Advances
language:en
Short-container-title:Sci. Adv.

Author:

Becker Christian¹^ORCID,Karnaushenko Daniil¹^ORCID,Kang Tong¹^ORCID,Karnaushenko Dmitriy D.¹,Faghih Maryam¹,Mirhajivarzaneh Alaleh¹,Schmidt Oliver G.¹²³⁴^ORCID

Affiliation:

1. Institute for Integrative Nanosciences, Institute for Solid State and Materials Research Dresden (Leibniz IFW Dresden), 01069 Dresden, Germany.

2. Material Systems for Nanoelectronics, Chemnitz University of Technology, 09107 Chemnitz, Germany.

3. Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Rosenbergstraße 6, TU Chemnitz, 09126 Chemnitz, Germany.

4. Nanophysics, Faculty of Physics, TU Dresden, 01062 Dresden, Germany.

Abstract

3D self-assembly advances parallel wafer-scale manufacturing of vector field devices such as 3D magnetic field angular encoders.

Funder

German research Foundation

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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